一个可靠性的PCB板，需要经过多轮测试。下面我们一起来看看16种常见的PCB可靠性测试。

A reliable PCB board requires multiple rounds of testing. Let's take a look at 16 common PCB reliability tests together.

阻焊膜硬度测试1. Hardness test of solder mask

测试目的：Test purpose:

检测阻焊膜硬度Test the hardness of solder mask

测试原理/设备：Testing principle/equipment:

标准测试铅笔的硬度排序：4B＞3B＞2B＞B＞HB＞F＞H＞2H＞3H＞4H＞5H＞6H

The hardness ranking of standard test pencils is: 4B>3B>2B>B>HB>F>H>2H>3H>4H>5H>6H

测试过程：Testing process:

将电路板放在平坦的表面上。使用标准测试笔在板上刮擦一定范围的硬度，直到没有刮痕。记录铅笔的最低硬度。

Place the circuit board on a flat surface. Use a standard test pen to scratch a certain range of hardness on the board until there are no scratches. Record the minimum hardness of the pencil.

测试结果说明：Test results indicate:

最低硬度应高于6H

The minimum hardness should be higher than 6H

2.离子污染测试2. Ion contamination testing

测试目的：Test purpose

测试板面污染程度。离子残留，通常是有极性的，有可能在线路板上引起电气化学效应。

Test the degree of contamination on the board surface. Ionic residues, usually polar, may cause electrochemical effects on circuit boards.

测试原理/设备：Testing principle/equipment:

离子污染机：通过测试样品单位表面积上离子数量的多少，来判断样品清洁度是否达到要求

Ion pollution machine: Determine whether the cleanliness of the sample meets the requirements by testing the number of ions per unit surface area of the sample

测试过程：Testing process:

使用75%异丙醇溶液对样品表面进行清洗15分钟，离子可以溶解到丙醇中，从而改变其导电性。记录电导率的变化以确定离子浓度。

Clean the surface of the sample with a 75% isopropanol solution for 15 minutes, and ions can dissolve into the isopropanol, thereby changing its conductivity. Record changes in conductivity to determine ion concentration.

测试结果说明：Test results indicate:

离子浓度≤6.45ug.NaCl/http://sq.in

Ionic concentration ≤ 6.45ug NaCl/ http://sq.in

3.固化测试 3. Curing test

测试目的：Test purpose:

测试阻焊膜/字符的抗化学侵蚀能力

Test the chemical resistance of solder mask/characters

测试原理/设备：Testing principle/equipment:

二氯甲烷 dichloromethane

测试过程：Testing process:

用滴管将适量二氯甲烷滴在试样表面上；

1. Use a dropper to drop an appropriate amount of dichloromethane onto the surface of the sample;

2.立即用白色棉布擦拭试样被测部位；

2. Immediately wipe the tested area of the sample with a white cotton cloth;

3.观察棉布及试样板面并作记录。

3. Observe the cotton fabric and sample surface and make records.

测试结果说明：Test results indicate:

白色棉布上不沾有阻焊膜或字符，板面阻焊膜及字符没有溶解变色现象。

There is no solder mask or characters on the white cotton cloth, and the solder mask and characters on the board surface do not dissolve or discolor.

4.TG值测试（玻璃化温度 ）4. TG value test (glass transition temperature)

测试目的：Test purpose:

通过示差量热分析仪(DSC）来测试PCB的玻璃化转变温度(TG)

Test the glass transition temperature (TG) of PCB using differential scanning calorimetry (DSC)

测试原理/设备：Testing principle/equipment:

DSC测试仪、电子天平、烘箱、干燥器

DSC tester, electronic balance, oven, dryer

测试过程：Testing process:

取样并将样品边缘打磨光滑，样品重量控制在15~25mg之间。将待测样品放入105℃的烘箱内烘烤2小时，取出放入干燥器内冷却至室温至少30分钟；

1. Take samples and polish the edges of the samples smooth, with a sample weight controlled between 15-25mg. Place the test sample in a 105 ℃ oven and bake for 2 hours, then take it out and place it in a dryer to cool to room temperature for at least 30 minutes;

2.将样品放在DSC的样品台上，设定升温速率是20℃/min，扫描终止温度视样品TG结果而定；

2. Place the sample on the sample stage of DSC, set the heating rate to 20 ℃/min, and the scanning termination temperature depends on the TG results of the sample;

3.重复2次扫描，从所得的热流曲线上，使用Universal Analysis软件分析得出玻璃化转变温度TG和∆TG 。

3. Repeat the scan twice and analyze the glass transition temperature TG and ∆ TG using Universal Analysis software from the obtained heat flux curve.

测试结果说明：Test results indicate:

TG值越高PCB性能越好，TG应高于135℃

The higher the TG value, the better the PCB performance, and the TG should be higher than 135 ℃

5.热应力测试 5. Thermal stress testing

测试目的：Test purpose:

测试基材和铜层的耐热程度

Test the heat resistance of the base material and copper layer

测试原理/设备：Testing principle/equipment:

恒温锡炉、秒表、烘箱

Constant temperature tin furnace, stopwatch, oven

测试过程：Testing process:

1.140℃条件下烘板4小时，取出冷却至室温。蘸取助焊剂。

Dry the board at 140 ℃ for 4 hours, then remove and cool it to room temperature. Dip in soldering flux.

将恒温锡炉温度调至288℃，将样品浮在锡面上，10秒后拿出。冷却至室温。

2. Adjust the temperature of the constant temperature tin furnace to 288 ℃, float the sample on the tin surface, and take it out after 10 seconds. Cool to room temperature.

3.可根据需要重复浮锡、冷却的步骤。

3. The steps of floating tin and cooling can be repeated as needed.

测试结果说明：Test results indicate:

表观观察，不允许出现分层、白点、阻焊脱落等情况；切片观察，无铜层断裂、剥离、基材空洞等情况。

Visually observed, no delamination, white spots, solder mask detachment, or other issues are allowed; Slicing observation shows no copper layer fracture, peeling, or substrate voids.

6.可焊性测试 6. Solderability testing

测试目的：Test purpose:

检验印制板表面导体及通孔的焊接性能

Inspect the soldering performance of conductors and through holes on the surface of printed boards

测试原理/设备：Testing principle/equipment:

恒温锡炉秒表、烘箱Constant temperature tin furnace stopwatch, oven

测试过程：Testing process:

1.105℃条件下烘板1小时，取出冷却至室温。蘸取助焊剂(中性，ALPHA100）；

Bake the board at 105 ℃ for 1 hour, then remove and cool to room temperature. Dip in soldering flux (neutral, ALPHA100);

2将恒温锡炉温度调至235℃,样品平行于锡面，摆动进入熔锡中，3秒后取出，冷却至室温。(评估表面焊盘可焊性)

2. Adjust the temperature of the constant temperature tin furnace to 235 ℃, and swing the sample parallel to the tin surface into the molten tin. After 3 seconds, remove it and cool it to room temperature. (Evaluate surface pad solderability)

3.将恒温锡炉温度调至235℃，样品垂直于锡面进入熔锡中，3秒后取出，冷却至室温。（评估镀通孔可焊性)

3. Adjust the temperature of the constant temperature tin furnace to 235 ℃, and the sample enters the molten tin perpendicular to the tin surface. After 3 seconds, remove it and cool it to room temperature. (Evaluate the solderability of plated through holes)

测试结果说明：Test results indicate:

表面(主要指SMT焊盘）润湿面积至少应95%。各镀通孔应完全浸润铅锡。

The wetting area of the surface (mainly referring to SMT pads) should be at least 95%. Each plated through-hole should be completely immersed in lead tin.

7.PCB剥离测试 7. PCB peeling test

测试目的：Test purpose:

检测刚性印制板在正常试验大气条件下的抗剥强度。

Test the peel strength of rigid printed boards under normal test atmospheric conditions.

测试原理/设备：Testing principle/equipment:

剥离强度测试仪Peel strength tester

测试过程：Testing process:

将试样上印制导线一端从基材上至少剥离10mm，对于成品印制板，其长度不少于75mm，宽度不小于0.8mm；

1. Peel off one end of the printed conductor on the sample from the substrate by at least 10mm. For finished printed boards, the length should not be less than 75mm and the width should not be less than 0.8mm;

2.将试样固定于剥离测试仪上，用夹具将印制导线夹住；

2. Fix the sample on the peeling tester and clamp the printed wire with a fixture;

3.以垂直于试样且均匀增加的拉力将印制导线剥离下来，若剥离长度不足25mm就断裂，试验重做；

3. Peel off the printed conductor with a uniformly increasing tension perpendicular to the specimen. If the peeling length is less than 25mm, it will break and the test will be redone;

4.记录抗剥力，并计算每毫米宽度上的抗剥力(即剥离强度）。

4. Record the peel resistance and calculate the peel strength per millimeter width.

测试结果说明：Test results indicate:

导线抗剥强度应不小于1.1N/mm

The anti stripping strength of the wire should not be less than 1.1N/mm

8.耐电压测试 8. Voltage endurance test

测试目的：Test purpose:

检测PCB板耐电压程度 Test the voltage resistance of PCB board

测试原理/设备：Testing principle/equipment:

耐电压测试仪Withstanding Voltage Testers

测试过程：Testing process:

将待测样品做适当清洗及烘干处理；

1. Clean and dry the test sample appropriately;

2.将耐电压测试仪+/-端分别连接到被测导体一端；

2. Connect the+/- terminals of the voltage withstand tester to one end of the tested conductor respectively;

3.耐电压测试仪电压值从OV升至500VDC，升压速率不超过100V/s。在500VDC的电压作用下持续时间30s。

3. The voltage value of the withstand voltage tester is increased from OV to 500VDC, and the boosting rate does not exceed 100V/s. Under the voltage of 500VDC for a duration of 30 seconds.

测试结果说明：Test results indicate:

测试过程中，绝缘介质或导体间距之间，不应出现电弧、火光等情况

During the testing process, there should be no arcing, flames, or other situations between the insulation medium or conductor spacing

9.CTE测试 9. CTE testing

测试目的：Test purpose:

评估PCB板的热变形系数

Evaluate the thermal deformation coefficient of PCB board

测试原理/设备：Testing principle/equipment:

TMA测试仪、烘箱、干燥器 TMA tester, oven, dryer

测试过程：TMA测试仪、烤箱、干燥器

取样并将样品边缘打磨光滑，样品尺寸6.35*6.35mm；

1. Take samples and polish the edges of the samples smooth, with a sample size of 6.35 * 6.35mm;

2.将待测样品放入105℃的烘箱内烘烤2小时，取出放入干燥器内冷却至室温至少30分钟；

2. Place the test sample in a 105 ℃ oven and bake for 2 hours, then take it out and place it in a dryer to cool to room temperature for at least 30 minutes;

3.将样品放在TMA的样品台上，设定升温速率是10℃/min，扫描终止温度设定为250℃；

3. Place the sample on the TMA sample stage, set the heating rate to 10 ℃/min, and set the scanning termination temperature to 250 ℃;

4.从所得的热流曲线上，使用Universal Analysis软件分析，分别得出板材在Tg点前后的CTE。

4. Analyze the obtained heat flow curve using Universal Analysis software to obtain the CTE of the sheet before and after the Tg point.

测试结果说明：Test results indicate:

使用Universal Analysis软件分析结果。

Use Universal Analysis software to analyze the results.

10.爆板测试 10. Explosion board test

测试目的：Test purpose:

评估PCB板基材的耐热程度

Evaluate the heat resistance of PCB substrate

测试原理/设备：Testing principle/equipment:

TMA测试仪、烘箱、干燥器TMA tester, oven, dryer

测试过程：Testing process:

取样并将样品边缘打磨光滑，样品尺寸6.35*6.35mm；

1. Take samples and polish the edges of the samples smooth, with a sample size of 6.35 * 6.35mm;

2.将待测样品放入105℃的烘箱内烘烤2小时，取出放入千燥器内冷却至室温至少30分钟；

2. Place the test sample in a 105 ℃ oven and bake for 2 hours, then take it out and place it in a drying oven to cool to room temperature for at least 30 minutes;

3.将样品放在TMA的样品台上，设定探头压力为0.005N，升温速率为10℃/min；

3. Place the sample on the TMA sample stage, set the probe pressure to 0.005N, and the heating rate to 10 ℃/min;

4.将样品温度升至260℃，当温度升至260℃时，恒定此温度60分钟，或直至测试失效为止，停止扫描；

4. Raise the sample temperature to 260 ℃. When the temperature reaches 260 ℃, maintain this temperature for 60 minutes or until the test fails, then stop scanning;

5.当出现明显分层时，可停止扫描；

5. When obvious stratification occurs, scanning can be stopped;

6.爆板时间定义为从恒温开始到明显分层为止之间的时间。记录此时间。

6. The bursting time is defined as the time between constant temperature and significant delamination. Record this time.

测试结果说明：Test results indicate:

爆板时间越长，说明PCB基材耐热程度越好。

The longer the explosion time, the better the heat resistance of the PCB substrate.

11.绿油溶解测试11. Green oil dissolution test

测试目的：Test purpose:

测试样本外表的防焊漆是否已经完成硬化，及足以应付在焊接时所产生热力。Test whether the solder mask on the surface of the test sample has hardened and is sufficient to withstand the heat generated during welding.

测试原理/设备：Testing principle/equipment:

三氯甲烷、秒表、碎布Trichloromethane, stopwatch, shredded cloth

测试过程：Testing process:

将数滴三氯甲烷滴于样本的防焊漆外表，并等候约一分钟；

1. Drop a few drops of chloroform onto the surface of the sample's solder mask and wait for about one minute

2.用碎布在滴过三氯甲烷的位置抹去，布面应没有防焊漆的颜色附上；

2. Use a piece of cloth to wipe off the area where chloroform has dripped, and the cloth surface should not have the color of the solder mask attached;

3.再用指甲在同样位置刮去。

3. Use your nails to scrape off in the same position.

测试结果说明：Test results indicate:

如果防焊漆没有被刮起，表示本试验合格。If the solder mask is not blown off, it indicates that the test is qualified.

12.无铅焊锡性试验 12. Lead free soldering test

测试目的：Test purpose:

为预知客户处置产品的焊锡状况，用Solder pot仿真客户条件焊锡。

To predict the soldering condition of products to be disposed of by customers, solder pot is used to simulate the soldering conditions of customers.

测试原理/设备：Testing principle/equipment:

烘箱、无铅锡炉、秒表、无铅助焊剂、10X放大镜

Oven, lead-free soldering furnace, stopwatch, lead-free soldering flux, 10X magnifying glass

测试过程：Testing process:

选择适当之试样，BGA及CPU没有用白板笔画过的，并确定试样外表清洁后，置入烤箱烘烤120C*1小时。试样取出后待其冷却降至室温。

1. Select appropriate samples, BGA and CPU that have not been drawn with a whiteboard pen, and ensure that the surface of the samples is clean. Place them in an oven and bake for 120c * 1 hour. After taking out the sample, let it cool down to room temperature.

2.将试样完全涂上助焊剂，试样须直立滴流5~10秒，使多余的助焊剂得以滴回。

2. Apply solder flux completely to the sample, and the sample should be dropped vertically for 5-10 seconds to allow excess solder flux to drip back.

3.将试样小心放在温度为260℃的锡池外表，漂浮时间3~5秒。

3. Carefully place the sample on the surface of a tin bath at a temperature of 260 ℃ and float for 3-5 seconds.

4.操作时需戴耐高温手套、袖套及防护面置﹐并使用长柄夹取放样品及试验。

4. During operation, it is necessary to wear heat-resistant gloves, sleeves, and protective surfaces, and use a long handle clamp to pick up and place samples for testing.

13.阻抗测试 13. Impedance testing

测试目的：Test purpose:

测量阻抗值是否符合要求

Measure whether the impedance value meets the requirements

测试原理/设备：Testing principle/equipment:

阻抗测试机 Impedance testing machine

测试过程：Testing process:

按阻抗测试机，操作标准进行测试。Test according to impedance testing machine and operating standards.

测试结果说明：Test results indicate:

依据客户要求According to customer requirements

14.孔拉力测试 14. Hole tension test

测试目的：Test purpose:

试验电镀孔铜的拉力强度Test the tensile strength of electroplated copper holes

测试原理/设备：Testing principle/equipment:

电烙铁，拉力测试机,铜线Electric soldering iron, tensile testing machine, copper wire

测试过程：Testing process:

将铜线直接插入孔内，以电烙铁加锡焊牢;

1. Insert the copper wire directly into the hole and solder it firmly with an electric soldering iron and tin;

2.被测试孔孔必需PAD面完整无缺，并将多余线路在PAD边切除;

2. The tested hole must have a complete and intact PAD surface, and any excess wiring must be cut off at the edge of the PAD;

3.将铜线的末端用拉力机夹紧，按拉力机上升，直到铜线被拉断或孔被拉出，计下读数C(Kg);

3. Clamp the end of the copper wire with a tensile machine and lift it up until the copper wire is broken or the hole is pulled out, then calculate the reading C (Kg);

4使用游标卡尺测量出孔的内径C2(mm)和孔环外径C1(mm)。

4. Use a vernier caliper to measure the inner diameter C2 (mm) of the hole and the outer diameter C1 (mm) of the hole ring.

测试结果说明：Test results indicate:

计算孔拉力强度F:ib/in2F= 4C/(C12-C22)*1420

Calculate the tensile strength F of the hole: ib/in2F= 4C/(C12-C22)*1420

15.高压绝缘测试 15. High voltage insulation test

测试目的：Test purpose:

测试线路板材料的绝缘性能

Test the insulation performance of circuit board materials

测试原理/设备：Testing principle/equipment:

高压绝缘测试仪，烘箱 High voltage insulation tester, oven

测试过程：Testing process:

烘烤板子，温度为50-60°C/3小时，冷却至室温，选样品上距离最近且互相不导通的一对线。

Bake the board at a temperature of 50-60 ° C/3 hours, cool to room temperature, and select the pair of wires closest to the sample that are non-conductive to each other.

按高压绝缘测试仪操作标准进行测试，测试要求为:

According to the operating standards of the high-voltage insulation tester, the testing requirements are:

线距<3mi1,所需电压250V,电流0.5A

1) Line spacing<3mi1, required voltage 250V, current 0.5A

2)线距≥3mi1，所需电压500V,电流0.5A

2) Line spacing ≥ 3mi1, required voltage 500V, current 0.5A

3)可根据客户要求设定电,压和电流

3) Electricity, voltage, and current can be set according to customer requirements

4)或按双面板用1000v，多层板用500v

4) Alternatively, use 1000V for double-sided panels and 500V for multi-layer panels

测试结果说明：Test results indicate:

维持通电30秒，若出现击穿现象，则表示样本不合格

Maintain power on for 30 seconds. If breakdown occurs, it indicates that the sample is not qualified

耐酸碱试验16. Acid and alkali resistance test

测试目的：Test purpose:

评估绿油耐酸碱能力

Evaluate the acid and alkali resistance of green oil

测试原理/设备：Testing principle/equipment:

H2SO4、NaOH、600#3M tape

测试过程：Testing process:

配制浓度为10%的H2SO4和10%的NaOH；

1. Prepare H2SO4 with a concentration of 10% and NaOH with a concentration of 10%;

2.样本放于烘箱内加热至约120±5℃，1小时；

2. Heat the sample in an oven to approximately 120 ± 5 ℃ for 1 hour;

3.将两组样品分别浸于以上各溶液中30分钟；

3. Soak the two sets of samples separately in the above solutions for 30 minutes;

4.取出样品擦干，用600#3M胶带紧贴于漆面上长度约2英寸长，用手抹3次胶面，确保胶带每次只可使用一次。

4. Take out the sample and dry it. Use 600 # 3M tape to stick it tightly to the paint surface, with a length of about 2 inches. Wipe the adhesive surface three times by hand to ensure that the tape can only be used once each time.

Above sorting：Unitech Group Quality department.

结语：Conclusion:

不同的PCB电路板产品，对可靠性的需求会不一样，有些要求适应高低温、有些需要扛住超高压、有些则对寿命要求特别高...因此不同电路板需要进行不同的可靠性测试，这需要具体产品具体分析。

Different PCB circuit board products have different requirements for reliability. Some require adaptation to high and low temperatures, some require withstanding ultra-high voltage, and some have particularly high requirements for lifespan Therefore, different circuit boards require different reliability tests, which require specific product analysis.